Fingerprint Recognition Technology Provider

Fingerprint Recognition Technology Provider
AGF300

FBI FAP30 Optical Fingerprint Module

Describe:

The AGF300 optical fingerprint module is a product that complies with certifications such as FBIPIV Mobile ID FAP30, CE, and FCC in the United States. A high-performance secure fingerprintmodule that complies with international standards such as ISO and ANSI, adopts industry-leadingoptical design, and has the advantages of large acquisition range and clear fingerprint imagepixels. The product adopts standard USB communication and can be flexibly embedded intovarious terminal devices with SDK development packages.


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Product Introduction

Product Features

Exquisite structure:67.6x36x15.1mm ultra thin structural design ;

Clear image:has residual fingerprint suppression function,Anti fake fingerprint technology,capable of capturing high-definition fingerprint images;

Efficient collection:adopting optical distortion free fingerprint imaging technology with fast acquisition speed ;

International standards:comply with international standards such as ISO19794-2,ISO19794-4, NIST imaging, ANSI378, and WSQ ;

High anti-counterfeiting: strong discrimination ability against fake fingerprints

High adaptability: normal acquisition and good adaptability to dry, cracked, dirty and wet finger conditions

Simple development: standard USB interface, source code SDK available



Product Specification  


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Parameter Indicators

Parameter Description

Electrical Parameters

Interface

USB1.1/2.0

supply voltage

5V (typical value)

range: 4.2V-5.5V

Working current

120mA(typical value)

Performance Index

Sensor type

optics

Acquisition method

Press type

Shell size

67.6x36x15.1mm

Collection window

24.0 x 26.0mm

Image size

400*500pixels

Resolution

500DPI

Distortion

≤1%

Gray level

8-bit 256 level

Gray level dynamic range

≥150

Collection time

≥15 Frame/s

Matching method

Comparison method (1:1) ;Search method (1: N)

Search time

<0.1s(1:1);<1s(1:N ,1000Pieces)

FAR

<0.0001% 

FRR

<0.5% 

Static electricity level

Contact discharge: ± 8KV ;Air discharge: ± 15KV

System support

Windows、Linux、Android

work environment

operation temperature

-30℃-+70℃

storage temperature

-40℃-+60℃

Working humidity

<90%R.H (Non condensing)

Storage humidity

20~93% R.H

Volume and weight

Volume

Length 67.6mm x width 36mm x height 15.1mm

Weight

47.5g


System Support 


Embedded, Linux, Android, Windows, standard SDK development kits and development manuals are available.




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