FBI FAP30 Optical Fingerprint Module
Describe:The AGF300 optical fingerprint module is a product that complies with certifications such as FBIPIV Mobile ID FAP30, CE, and FCC in the United States. A high-performance secure fingerprintmodule that complies with international standards such as ISO and ANSI, adopts industry-leadingoptical design, and has the advantages of large acquisition range and clear fingerprint imagepixels. The product adopts standard USB communication and can be flexibly embedded intovarious terminal devices with SDK development packages.
Product Features
Exquisite structure:67.6x36x15.1mm ultra thin structural design ;
Clear image:has residual fingerprint suppression function,Anti fake fingerprint technology,capable of capturing high-definition fingerprint images;
Efficient collection:adopting optical distortion free fingerprint imaging technology with fast acquisition speed ;
International standards:comply with international standards such as ISO19794-2,ISO19794-4, NIST imaging, ANSI378, and WSQ ;
High anti-counterfeiting: strong discrimination ability against fake fingerprints
High adaptability: normal acquisition and good adaptability to dry, cracked, dirty and wet finger conditions
Simple development: standard USB interface, source code SDK available
Product Specification
Classify | Parameter Indicators | Parameter Description |
Electrical Parameters | Interface | USB1.1/2.0 |
supply voltage | 5V (typical value) range: 4.2V-5.5V | |
Working current | 120mA(typical value) | |
Performance Index | Sensor type | optics |
Acquisition method | Press type | |
Shell size | 67.6x36x15.1mm | |
Collection window | 24.0 x 26.0mm | |
Image size | 400*500pixels | |
Resolution | 500DPI | |
Distortion | ≤1% | |
Gray level | 8-bit 256 level | |
Gray level dynamic range | ≥150 | |
Collection time | ≥15 Frame/s | |
Matching method | Comparison method (1:1) ;Search method (1: N) | |
Search time | <0.1s(1:1);<1s(1:N ,1000Pieces) | |
FAR | <0.0001% | |
FRR | <0.5% | |
Static electricity level | Contact discharge: ± 8KV ;Air discharge: ± 15KV | |
System support | Windows、Linux、Android | |
work environment | operation temperature | -30℃-+70℃ |
storage temperature | -40℃-+60℃ | |
Working humidity | <90%R.H (Non condensing) | |
Storage humidity | 20~93% R.H | |
Volume and weight | Volume | Length 67.6mm x width 36mm x height 15.1mm |
Weight | 47.5g |
System Support
Embedded, Linux, Android, Windows, standard SDK development kits and development manuals are available.
- None
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